SMART announced today its new line of ultra low profile 240-pin registered DDR2 DIMMs in densities of 512MB, 1GB, and 2GB. These new 1.0″ registered memory modules are 15 percent lower in height than industry-standard PC2-3200 and PC2-4300 DIMMs. SMART’s DDR2 modules operate at system clock speeds of 200MHz and 267MHz with data transfer rates of 3.2 GB/s and 4.3 GB/s, respectively. SMART’s 2GB ultra low profile DDR2 DIMM utilizes state-of-the-art ball grid array (BGA) stacking technologies. The module is designed for stacked 512Mb (128Mx4) BGA devices that provide a cost-effective, high-density solution compared to a 1Gb monolithic-based version.

DDR2RegUltra SMART Ultra Low Profile Reg. DDR2

SMART Modular Technologies, Inc. announced today its new line of ultra low
profile 240-pin registered DDR2 DIMMs in densities of 512MB, 1GB, and 2GB. These
new 1.0" registered memory modules are 15 percent lower in height than
industry-standard PC2-3200 and PC2-4300 DIMMs. SMART’s DDR2 modules operate at
system clock speeds of 200MHz and 267MHz with data transfer rates of 3.2 GB/s
and 4.3 GB/s, respectively.

Typical 1U networking and blade server applications can accommodate
industry-standard 1.18" DDR2 registered 240-pin DIMMs. However, the trend toward
more integration between blade servers and network switching equipment requires
even lower height clearances. New integrated systems use between 8GB to 16GB of
DDR2 memory for storing packet data and transaction history, and the memory is
configured onto a processor board that is connected adjacent to the network
switch. The whole assembly is required to fit in one sub-1U chassis slot.
SMART’s 1.0" DDR registered DIMMs allow the integrated server board and network
switch to fit into this chassis while maintaining proper airflow.

SMART’s 2GB ultra low profile DDR2 DIMM utilizes state-of-the-art ball grid
array (BGA) stacking technologies. The module is designed for stacked 512Mb
(128Mx4) BGA devices that provide a cost-effective, high-density solution
compared to a 1Gb monolithic-based version.

SMART’s DDR2 modules offer a range of leading-edge technology benefits such as
lower power and higher peak bandwidth that are beneficial for applications such
as 1U blade servers, high-density clusters, high performance desktop PCs,
networking equipment, and mobile platforms.

SMART’s DDR2 DIMMs pass through comprehensive design verification testing (DVT).
This product launch process includes extensive pre-layout and post-layout
simulation, as well as in-house system testing on Intel’s DDR2 Lindenhurst and
Grantsdale server and desktop reference platforms. Modules are qualified and
built using components from leading suppliers of DRAMs, PLLs, and registers.
They are then tested on advanced test systems using an extensive suite of
proprietary test programs.

SMART’s low profile registered DDR2 DIMMs include both standard and lead-free
versions. The part numbers are listed in the table below.


SMART P/N

Description

Density

Module Config.

Device Config.

Standard

SM572644FG8E6DB01

PC2-3200 3-3-3

512MB

64Mx72

 64Mx4
SM572284FG8E0DB01PC2-3200 3-3-31GB128Mx72128Mx4

SM572564FG8E8DB01

PC2-3200 3-3-3

2GB

256Mx72

128Mx4

Lead-free

SB572644FG8E6DB01

PC2-3200 3-3-3

512MB

64Mx72

64Mx4
SB572284FG8E0DB01PC2-3200 3-3-31GB128Mx72128Mx4

SB572564FG8E8DB01

PC2-3200 3-3-3

2GB

256Mx72

128Mx4

 In addition to its low profile DDR2 registered modules, SMART also offers a
complete line-up of standard DDR (PC2-3200 and PC2-4300) modules including
240-pin unbuffered ECC and non-ECC DIMMs, registered DIMMs, and 200-pin
SO-DIMMs.