Sun unveiled its next generation UltraSPARC® IV+ processor at In-Stat MDR’s Fall Processor Forum. UltraSPARC IV+, powered by Chip Multithreading technology, continues Sun’s momentum in delivering on its Throughput Computing strategy by enabling a large number of operations, or threads, to be executed simultaneously in order to increase system performance. Implemented using Texas Instruments’ 90 nanometer process technology, UltraSPARC IV+ will double the application throughput of the existing UltraSPARC IV through expanded caches and buffers, a better branch prediction mechanism, augmented prefetching capabilities and new computational abilities. In addition, UltraSPARC IV+ incorporates a new 3-level cache hierarchy, with a fast on-chip 2MB second level cache and a large 32MB off-chip third level cache.

Sun Microsystems, Inc. today unveiled its next generation UltraSPARC® IV+
processor at In-Stat MDR’s Fall Processor Forum. UltraSPARC IV+, powered by Chip
Multithreading technology, continues Sun’s momentum in delivering on its
Throughput Computing strategy by enabling a large number of operations, or
threads, to be executed simultaneously in order to increase system performance.

"Sun is showing the market that it is serious about delivering on the promise
of Throughput Computing," said Kevin Krewell, senior analyst for Microprocessor
Report. "The UltraSPARC IV+ is the second generation of Sun’s evolutionary
dual-core design. We are impatiently awaiting the revolutionary Niagara
processor to hit the market in 2006. This will be a huge departure from
conventional processor design that will subsequently alter the face of network
computing infrastructure as we know it."

Implemented using Texas Instruments’ 90 nanometer process technology,
UltraSPARC IV+ will double the application throughput of the existing UltraSPARC
IV through expanded caches and buffers, a better branch prediction mechanism,
augmented prefetching capabilities and new computational abilities. In addition,
UltraSPARC IV+ incorporates a new 3-level cache hierarchy, with a fast on-chip
2MB second level cache and a large 32MB off-chip third level cache.

These new performance features combine with much higher operating frequencies
(1.8 Ghz initially) to make UltraSPARC IV+ the highest throughput UltraSPARC
processor ever built, with roughly twice the per-thread performance of the
original UltraSPARC IV processor. At the same time, an array of new RAS features
cooperate to make this design the most reliable UltraSPARC processor ever.

As with the UltraSPARC IV processor, this new second generation UltraSPARC
IV+ processor maintains Sun’s tradition of binary compatibility, preserving the
investment customers have made in development tools and application software. It
provides Sun customers with an easy upgrade path that effectively raises both
the performance and reliability of their system with no change in its footprint,
and relatively little change in either its power or thermal envelope.

More information on Sun’s Throughput Computing strategy and Chip
Multithreading can be found at

www.sun.com/processors/throughput
. More information on Fall Processor Forum
can be found at
www.mdronline.com/fpf04/