The MCX604-V™ heatsink is a high performance, low noise thermal solution for Intel® Xeon™ processors with 800MHz system bus (mPGA socket 604), code named “Nocona”. This heatsink is primarily intended for quality system builders and integrators, and thus ships with a factory fan. The MCX604-V™ meets and exceeds Intel® Xeon™ thermal & mechanical design specifications.
The MCX604-V™ heatsink is a high
performance, low noise thermal solution for Intel® Xeon™ processors
with 800MHz system bus (mPGA socket 604), code named "Nocona". This
heatsink is primarily intended for quality system builders and
integrators, and thus ships with a factory fan. The MCX604-V™ meets and
Intel® Xeon™ thermal & mechanical design specifications.
- Optimized performance characteristics at the
lowest possible audible noise levels.
- Hybrid copper base, thin
aluminum pin heatsink: the massive 1/2" thick copper base
provides superior heat capacity for unparalleled stability in extreme
load applications. The thin aluminum pins promote increased turbulence
for more efficient heat dissipation compared to traditional fin
- Patented Helicoid pin design
(U.S. patent 6,469,898): pins are individually machined in an helicoid
shape, to increase their surface area, and further enhance heat
- Several patents pending for concentrically aligned
rows of pins, bent at multiple angles. The spacing and angles between
the concentric rows has been precisely calculated to optimize cooling
and reduce noise at air flow levels as low as 22 CFM and 23 dbA.
- Quick and easy fan installation:
the fan installs "in a snap" with convenient snap-in rivets.
- Exceptional quality and attention to details:
the heatsink base is lapped to 0.0003" (3/10 of 1/1000"), and polished
to near-mirror finish to promote optimum thermal conductivity. Users are
advised that while flatness is strictly respected for providing the most
significant benefit to thermal interface, surface polish is a cosmetic
component and may vary slightly from one heatsink to another. Re-lapping
or polishing the heatsink base is never recommended.
- Asymetric pin design to allow multiprocessor
- Processor Compatibility:
all Intel® Xeon® "Nocona" processors
- Motherboard compatibility:
All (1) Intel®
compliant motherboards socket 604 (800MHz system
bus) form factor, in single or multi-processor confirguration
- Rack mount chassis
2U and above.
Retention Mechanism – Installation
Part # MCX604-VRK for Xeon™ "Nocona" is also available for upgrade of all
MCX603-V™ heatsinks versions shipped after 12-15-03 (see
°C/Watts ratio (*)
* The C/W shown is the heat sink to air value, excluding
thermal resistance of the TIM joint, which will vary depending on the
thermal interface used and bench test conditions. For reference,
Swiftech’s TIM joint bench test value is 0.09°C/W. All tests are performed
in an environmental chamber using Industry standard procedures, and
- CNC machined, C110 copper base, 3"W x 3.3"L x .500"H,
flatness better than 0.0003", micro surface finish 8 or better.
- 374 Helicoid Pins made of High Thermal Conductivity
Aluminum Alloy, press fitted in the base.
- Heatsink base dimensions 3"x3.3"x1.66"
- Heatsink top dimension 3 3/4" x 3 1/2"
- Weight: 23 oz (650g)
- Overall height (with fan and fan guard): 2.83"
Bearing type: dual Ball Bearing
Features: RPM sensor
7.0 to 13.8