Now put some thermal grease on the CPU heatspreader.

You can then spread it with a card or a clean (gloved) finger.

Before we move on to any test, we would like to use the Intel
“stock” heatsink as a point of reference to the Titan Vanessa Type “S’
and Type “L” performances.

Check out the base of the HSF. Use of a copper heatspreader
and aluminium fins has proven to be an effective combination for combating Prescott
heat since the days of Socket 478. The base appears relatively flat, though
the cosmetic “mirror base” is not present here. The key to proper
thermal contact is after all a flat base, and not necessarily a shiny one.

The fan is produced by Nidec, rated at 12V, 0.42A. It is surprisingly
silent at full throttle. The blades appear to cover a 92 mm diameter.

To ensure fairness in the test, the Intel HSF was attached
and run with the same thermal compound (Nano Blue) supplied by Titan.

You will see in the picture above that the fan does not
just directs air over the fins, but also over the MOSFET VRM circuitry. In
an event where there is lack of airflow over the MOSFETs, catastrophic failure,
instability, Vcore fluctuation and premature hardware damage may result. This
is the primary reason why most of the aftermarket heatsinks tends towards the
original Intel HSF design to comply to LGA standards, therefore being certified for foolproof use.

In our tests, we did not run into any MOSFET overheating problems
without forced-air cooling of the VRM circuitry.

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