TSMC today announced that its industry-leading low-k
technology has entered mainstream production following the introduction today of
ATI’s MOBILITY RADEON 9700. The introduction of the low-k graphics processor to
the notebook PC market reaffirms the arrival of the low-k technology era. Low-k
technology improves device performance while reducing power consumption, making
it an ideal choice for both high-performance and low-power applications. TSMC’s
low-k technology also offers design ease, which reduces overall design time due
to a better power delay trade-off than that of FSG counterpart. The 90nm Nexsys
technology is the first process technology based entirely on low-k dielectrics,
and is ramping to production this quarter." ATI’s MOBILITY RADEON 9700 is the
first notebook PC 3D graphics processor to be built on a low-k process. The
MOBILITY RADEON 9700 provides the industry’s fastest mobile clock speeds while
reducing power consumption, two key elements for success in the notebook
graphics market.

Key features of the MOBILITY RADEON 9700 include:

Introduces low-k technology for the fastest mobile performance
and longest battery life
Most advanced mobile technology to drive over 100 of the top DirectX® 9.0 game
titles
Four powerful rendering pipelines that deliver the ultimate cinematic visuals
Features POWERPLAY™ 4.0 so you can get the most life out of your notebook
battery – without sacrificing performance
First in the industry to deliver SMARTSHADER™ Effects which delivers a unique
visual experience to the look of games
Features ATI’s VPU RECOVER for the industry’s most stable 3D acceleration
software


TSMC today announced that its industry-leading low-k
technology has entered mainstream production following the introduction today of
ATI’s MOBILITY RADEON 9700. The introduction of the low-k graphics processor to
the notebook PC market reaffirms the arrival of the low-k technology era.

"TSMC is the only semiconductor foundry with two generations
of proven low-k technology in production, including both the 0.13-micron and
90nm nodes," said Genda Hu, vice president of marketing for TSMC. "The volume
production of ATI’s MOBILITY RADEON 9700 vividly demonstrates the growing trend
toward low-k based products."

Low-k technology improves device performance while reducing power consumption,
making it an ideal choice for both high-performance and low-power applications.
TSMC’s low-k technology also offers design ease, which reduces overall design
time due to a better power delay trade-off than that of FSG counterpart. This
combination allows designers to take immediate advantage of TSMC’s 0.13-micron
and 90nm Nexsys(SM) Technology for SoC design. The 90nm Nexsys technology is the
first process technology based entirely on low-k dielectrics, and is ramping to
production this quarter."

While many semiconductor companies struggle to qualify low-k manufacturing, TSMC
has delivered dozens of low-k customer products into volume production. The
company manufactured over 10,000 production wafers using this technology in
2003, and expects to ramp its low-k technology in both 0.13-micron and 90-nm
nodes significantly in the coming years. TSMC is expected to deliver over
100,000 low-k wafers in 2004.

TSMC has led the advancement of low-k dielectrics for the past three years. TSMC
was the first company to announce its intention to use CVD-based low-k
dielectrics in January 2001, and became the first company to production-qualify
its 0.13-micron low-k process in August of 2002. TSMC’s 0.13-micron copper/low-k
yields now rival those of wafers using traditional FSG dielectrics. More
important, TSMC’s proven low-k film, combined with copper interconnects, drives
higher device performance and lower power consumption, irrespective of other
design enhancements. This means low-k technology will amplify any new
semiconductor design improvement.

Moreover, TSMC, in collaboration with leading package service providers, has
resolved the package issues that in many cases continue to plague the adoption
of low-k technology by other semiconductor companies. Packaging solutions for
mainstream package types have been established and are already available from
multiple vendors.

ATI’s MOBILITY RADEON 9700 is the first notebook PC 3D graphics processor to be
built on a low-k process. The MOBILITY RADEON 9700 provides the industry’s
fastest mobile clock speeds while reducing power consumption, two key elements
for success in the notebook graphics market.

ATI Technologies today set a new industry standard with the
introduction of the first low-k based graphics solution for notebook PCs. The
MOBILITY™ RADEON™ 9700 was unveiled today at a product launch gala event in
Taipei, Taiwan.

As the first mobile graphics provider to support Microsoft® DirectX®9.0, ATI has
a proven track record of pushing the envelope in mobile visual processing. The
addition of low-k extends the company’s lead in notebook graphics innovation,
providing key enhancements to enable the industry’s highest mobile clock speeds
while reducing power consumption. MOBILITY RADEON 9700 is a robust solution that
fully leverages DirectX®9.0 capabilities to provide the most powerful mobile
graphics solution on the market today.

MOBILITY RADEON 9700 will power notebooks from such industry leaders as Acer,
Alienware, Fujitsu-Siemens, Gericom, LG, Medion, Packard Bell, rockdirect,
Samsung, Targa and VoodooPC. In addition, leading original design manufacturers
such as Asus, Clevo, Compal, ECS, FIC, Quanta, Uniwill and Wistron will offer
notebooks including the MOBILITY RADEON 9700.

“ With recent advances in mobile graphics technology, consumers can now enjoy a
rich visual experience from their notebook PC that rivals that of the desktop,”
said Phil Eisler, Vice President and General Manager. Mobile and Integrated
Products Group, ATI Technologies Inc. “ATI is extending its market leadership in
notebook graphics by pioneering the use of low-k technology to offer new levels
of performance and power efficiency with the introduction of MOBILITY RADEON
9700.”

ATI worked closely with TSMC, to develop and implement a low-k technology for
the MOBILITY RADEON 9700. TSMC’s low-k technology reduces device capacitance at
the interconnect level to enhance the performance of ATI’s proprietary
technologies that are built into the MOBILITY RADEON 9700.

“The emergence of low-k products such as the MOBILITY RADEON 9700 is a prime
indicator of a fundamental shift in semiconductor process technologies,” said
F.C. Tseng, deputy chief executive officer at TSMC. “TSMC is the only foundry
with two generations of production-proven low-k based semiconductor processes,
enabling companies like ATI to make great strides in device performance and
optimization. The introduction of MOBILITY RADEON 9700, brings low-k technology
into the mainstream, fully harnessing these new capabilities for mobile users
around the globe.”

Valve software, the award winning software house responsible for the smash hit
Half-Life and the forthcoming Half-Life 2, recently had the opportunity to
experience the MOBILITY RADEON 9700 first hand. "ATI has earned its leadership
position in the desktop GPU market by consistently delivering top performing
products," said Gabe Newell, Managing Director, Valve. "With its latest mobile
products, ATI is extending its line of superior product offerings to new
markets. If you’re going to play games on a mobile PC, play it on a MOBILITY
RADEON 9700."

Key features of the MOBILITY RADEON 9700 include:
Introduces low-k technology for the fastest mobile performance and longest
battery life;
Most advanced mobile technology to drive over 100 of the top DirectX® 9.0 game
titles;
Four powerful rendering pipelines that deliver the ultimate cinematic visuals;

Features POWERPLAY™ 4.0 so you can get the most life out of your notebook
battery – without sacrificing performance;
First in the industry to deliver SMARTSHADER™ Effects which delivers a unique
visual experience to the look of games; and
Features ATI’s VPU RECOVER for the industry’s most stable 3D acceleration
software