TSMC recently confirmed reports that it will build two more 300mm wafer fabs at the Hsinchu Science Park and construction will begin in April next year. Fve new wafer fabs will be built at the park soon, including the two each planned by TSMC and PSC. TSMC announced that the company`s director board already approved the company`s US$ 1.13 billion capital expenditure plan for next year. The money will be mostly spent on expansions at its 300mm wafer fabs providing 65nm and 90nm processes.

TSMC recently confirmed reports that it will build two more 300mm wafer fabs at the Hsinchu Science Park and construction will begin in April next year. Fve new wafer fabs will be built at the park soon, including the two each planned by TSMC and PSC. TSMC announced that the company`s director board already approved the company`s US$ 1.13 billion capital expenditure plan for next year. The money will be mostly spent on expansions at its 300mm wafer fabs providing 65nm and 90nm processes.