Intel is going to implement 2 new sockets for the next generation Nehalem architecture in 2008 and they are Socket B and Socket H. As we know, Nehalem is 45nm based and we are going to see some exciting changes such as IMC (Integrated Memory Controller) and CSI. Socket B will be LGA1366 and Socket H will be LGA715. The reason why Socket B has so many more contact pads is pretty obvious. It is due to the IMC on the Nehalem CPU. Since there is a Socket H version as well, we can expect there will be another Nehalem based CPUs without IMC.

Intel is going to implement 2 new sockets for the next generation Nehalem architecture in 2008 and they are Socket B and Socket H. As we know, Nehalem is 45nm based and we are going to see some exciting changes such as IMC (Integrated Memory Controller) and CSI. Socket B will be LGA1366 and Socket H will be LGA715. The reason why Socket B has so many more contact pads is pretty obvious. It is due to the IMC on the Nehalem CPU. Since there is a Socket H version as well, we can expect there will be another Nehalem based CPUs without IMC.