ibm Logo UMC and IBM to create 20nm FinFET chip

After having reportedly landed a contract to produce Qualcomm’s Snapdragon S4 chip, United Microelectronics Corp (UMC) has confirmed that they will be partnering with IBM Corp to produce a next gen 20nm chip that features FinFET 3D transistors.

After having reportedly landed a contract to produce Qualcomm’s Snapdragon S4 chip, United Microelectronics Corp (UMC) has confirmed that they will be partnering with IBM Corp to produce a next gen 20nm chip that features FinFET 3D transistors.

FinFET is a space saving, finbased, multigate architecture aimed at energy efficiency.  According to UMC, they are hoping that their 20nm R&D capacity along with IBM’s FinFET know-how will help expedite the development of the next gen 20nm chip.

“We are happy to engage with a recognized technology leader such as IBM for this technology advancement effort,” says UMC’s VP, I.C. Chen.

“Leveraging IBM’s technology expertise to shorten our 20nm and FinFET R&D cycle will create a win-win situation for UMC and our customers.”

UMC has announced prior that it plans to invest $8 billion to expand its 28nm chip making capacity, and therefore establishing a solid foundation for R&D of 20nm chips in the future. 

Source: taipeitimes.com