VIA CN700 IGP Chipset For C7

CN700 Chipset L s VIA CN700 IGP Chipset For C7

VIA Technologies, Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today announced the VIA CN700 IGP
chipset, featuring leading digital media technologies and advanced low power
design to enable system design innovation across a wide range of VIA C7™
processor-powered devices, such as mini PCs, fanless embedded commercial systems
and stylish, quiet home entertainment centers for the living room. VIA CN700 is
expected to be available in volume quantities in Q1 2006.

CN700 Logo L VIA CN700 IGP Chipset For C7

CN700 Chipset L VIA CN700 IGP Chipset For C7

VIA Technologies, Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today announced the VIA CN700 IGP
chipset, featuring leading digital media technologies and advanced low power
design to enable system design innovation across a wide range of VIA C7™
processor-powered devices, such as mini PCs, fanless embedded commercial systems
and stylish, quiet home entertainment centers for the living room.

CN700 BlkDiagram L VIA CN700 IGP Chipset For C7

The integrated S3 Graphics UniChrome Pro™ IGP core ensures exceptional 2D/3D
graphics performance and a truly Hi-Def™ experience, with flexible display
outputs for CRT and LCD, as well as standard definition and HDTV up to 1080p
resolution with a compatible DVI or TV encoder, while the signature hardware
MPEG-2 decoding and the intelligent video rendering techniques of the Chromotion
CE Video Display Engine deliver smooth video playback.

Supporting the VIA V4 bus up to 533MHz, the VIA CN700 IGP chipset leverages
support for both DDR2 and DDR memory modules with built-in system and graphics
power management, to deliver a highly flexible solution for developers looking
to design powerful and feature-rich yet compact and quiet desktop and embedded
devices.

"The VIA CN700 chipset was specifically designed to enable the VIA C7 processor
platform to deliver great system and digital media performance without
compromise," commented Chewei Lin, Vice President of Product Marketing, VIA
Technologies, Inc. "With its integrated S3 Graphics UniChrome Pro core, and
featuring support for the latest DDR2 memory and the high bandwidth V4 bus, the
CN700 is equipped with all the right tools to enable a new generation of ultra
low power, quiet, compact, stylish and ultra reliable devices."

Combined with the VIA VT 8237A South Bridge, the VIA CN700 offers a
comprehensive range of integrated storage, multimedia and connectivity options,
including native Serial ATA and multiple configuration V-RAID, support for VIA
Vinyl High Definition Audio, and high-throughput Gigabit Ethernet with the VIA
Velocity controller.

Product Availability and Pricing
VIA CN700 is expected to be available in volume quantities in Q1 2006. Pricing
is available upon request.

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