CX700 s VIA CX700 IGP Chipset

VIA today announced the VIA CX700 digital
media IGP chipset for the VIA C7® and Eden® processor platforms, the most
advanced x86 embedded chipset that integrates all the cutting-edge features of a
modern chipset’s North and South bridges, including rich video graphics, HD
audio, and DDR2 and SATA II support, into a single, compact and highly
power-efficient package. Enhanced video quality is provided through the proven VIA UniChrome™ Pro IGP core with its 128-bit 2D/3D graphics, acclaimed hardware MPEG-2 video
decoding acceleration and intelligent video rendering technology of the
Chromotion™ CE video display engine; this is complemented by the VIA Vinyl HD
Audio controller supporting up to eight high definition channels delivering a
richer all-round digital media experience. The VIA CX700 is expected to be
available in volume quantities later in Q2 2006.

CX700 Logo VIA CX700 IGP Chipset

VIA Technologies, Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today announced the VIA CX700 digital
media IGP chipset for the VIA C7® and Eden® processor platforms, the most
advanced x86 embedded chipset that integrates all the cutting-edge features of a
modern chipset’s North and South bridges, including rich video graphics, HD
audio, and DDR2 and SATA II support, into a single, compact and highly
power-efficient package.

Designed specifically for the embedded market and already adopted by leading
industry players, the VIA CX700 will be on display at the VIA booth #1145 and
partners’ booths at the Embedded Systems Conference show in San Jose, California
this week.

"A true single-chip integration that delivers the performance, flexibility
and power efficiency demanded by embedded developers, the CX700 looks set to
drive x86 further into the embedded space and enhance VIA’s momentum in this
market," said Chinhwaun Wu, Special Assistant to the President, Processor
Platform Product Marketing, VIA Technologies, Inc. "Fully embodying VIA’s design
strategy of shrinking the platform while supporting contemporary video, audio,
memory and peripheral technologies, the CX700 represents the next phase of
innovation in enabling more compact and sophisticated x86 systems."

Rich Feature Integration

CX700 blkdiagram VIA CX700 IGP Chipset

A host of leading digital media, memory and connectivity technologies are
packed into the single-chip package of the VIA CX700:

Video – Enhanced video quality is provided through the proven VIA UniChrome™ Pro
IGP core with its 128-bit 2D/3D graphics, acclaimed hardware MPEG-2 video
decoding acceleration and intelligent video rendering technology of the
Chromotion™ CE video display engine; this is complemented by the VIA Vinyl HD
Audio controller supporting up to eight high definition channels delivering a
richer all-round digital media experience.

Memory – VIA’s renowned memory controller technology has been incorporated into
the VIA CX700, with support for both DDR400 and the high-bandwidth DDR2533
memory up to 4GB with ECC capability, and 32-bit as well as 64-bit system memory
to extend performance, design and cost flexibility to developers.

Connectivity – Broad connectivity comes with support for SATA, SATA II and PATA
drives, two COM and six USB2.0 ports, and four PCI slots, allowing for
considerable flexibility in board configuration. Moreover, developers can also
integrate support for ISA through an ITE PCI bridge chip, combining legacy ISA
connectivity with high bandwidth DDR2 memory support for far more powerful
embedded systems.

Display – Flexibility is extended to display technologies, with the VIA CX700
integrating a multi-configuration LVDS/DVI transmitter, a popular feature for
embedded systems, as well as standard TV-out, and incorporating DuoView to
enable dual screen display.

CX700 VIA CX700 IGP Chipset

Stepping Up the Pace of Miniaturization
The VIA CX700 exemplifies VIA’s design philosophy of reducing the size of the
platform in order to enable ever smaller, cooler and lighter systems. In the
CX700, VIA has integrated all the key functionality of both the North and South
bridges of a regular VIA chipset into a single chip package exactly the same
size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34%
in board real estate. This represents a major breakthrough for the embedded
industry where ultra compactness is essential, and will have significant benefit
for embedded boards such as PC/104 and VIA EPIA mainboards.

VIA’s Signature Power Efficiency
Complementing the power-efficient VIA C7 and fanless VIA Eden processors it
supports, the VIA CX700 is based on a highly sophisticated power efficient
architecture that enables such rich integration into a compact package with a
maximum power envelope of just 3.5 watts. A number of key power management
technologies are incorporated that monitor activity and dynamically control
power according to system load requirements.

Designed for Embedded
Targeted for key embedded applications such as Point of Sales (POS)
equipment, industrial PCs (IPC) and ultra compact, low power desktop systems
such as thin clients, the VIA CX700 has been designed from the ground up to
deliver excellent performance, features and power efficiency. The reduction in
board space and operating power requirements together with the extensive
multimedia, memory, connectivity and display flexibility provides embedded
customers with the ideal chipset to take their ultra compact systems to the next
stage.

Broad Industry Support
The benefits of the VIA CX700 have been recognized by several leading embedded
industry players, including Advantech, Diamond Systems, Freetech Flexus Computer
Technology and WinSystems, some of whom will be showcasing VIA CX700-based
boards at ESC, and are full of support for this ground-breaking chipset:

"Until now, creating an ultra-compact form factor mainboard with unparalleled
visual connectivity has been a complex process. However, with the VIA CX700
Advantech SOM-ETX solution can offer our customers a solution that supports dual
screens, CRT/TV and direct LVDS connection all from a single silicon solution,"
said Jeff Chen, Chief Technology Officer, Advantech.

"Highly integrated, very low-power products like the CX700 from VIA are key to
small, high-performance single board computer designs," said Robert A. Burckle,
Vice-President of WinSystems. "VIA has engineered the right balance of features
and performance into this new x86-compatible chipset that are ideal for the
embedded market."

"VIA’s innovation in its embedded chipset family is setting new standards for
low power dissipation at a high performance level in the embedded market place,"
said Matt Schiltz, General Software’s CEO. "We are pleased to offer VIA
customers Embedded BIOS® 2000 support for this exciting new member of the VIA
family of silicon products, the VIA CX700. General Software is committed to
working with VIA to help ensure the continued success of their embedded
customers."

Product Availability and Pricing

The VIA CX700 is expected to be available in volume quantities later in Q2
2006. Pricing is available upon request. Further information about the
single-chip VIA CX700 digital media IGP chipset may be found at the VIA website
at:

http://www.via.com.tw/en/products/chipsets/c-series/cx700/.