cx700m main VIA Unified CX700M Chipset w/ HDTV support

VIA today introduced the VIA CX700M digital media IGP chipset for the VIA C7®
and Eden® processor platforms. Designed specifically for the embedded market,
the VIA CX700M integrates premium graphics, audio, memory, storage, and HDTV
support all in a single chip design. This unified design enables the creation of
smaller form factor designs, reduced power consumption, and easier cooling, all
of which opens the door for an expanded range of embedded solutions. Measuring
just 35mm x 35mm, the VIA CX700M generates a silicon real estate saving of over
42%. A host of leading digital media, memory and connectivity technologies are
packed into the compact design of the VIA CX700M. The VIA CX700M is expected to
be available in volume quantities later in Q3 2006.

VIA Technologies, Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today introduced the VIA CX700M digital
media IGP chipset for the VIA C7® and Eden® processor platforms.

Designed specifically for the embedded market, the VIA CX700M integrates premium
graphics, audio, memory, storage, and HDTV support all in a single chip design.
This unified design enables the creation of smaller form factor designs, reduced
power consumption, and easier cooling, all of which opens the door for an
expanded range of embedded solutions.

“Building on the success of earlier single chip solutions for the embedded
market, the VIA CX700M clearly demonstrates VIA’s leadership in integration of
the latest features such as HDTV support into smaller and smaller designs,” said
Chinhwaun Wu, Special Assistant to the President, Processor Platform Product
Marketing, VIA Technologies, Inc. “As demand increases for embedded devices in
the living room, or in applications such as high definition point of sale
displays, the VIA CX700M provides an ideal platform to propel a new wave of
solutions ready for the latest high definition content and displays.”

The VIA CX700M will be on display at VIA’s booth #601 at the Embedded System
Conference Boston, being held at the Hynes Convention Centre from September
26-27, 2006.

Highly Integrated

Measuring just 35mm x 35mm, the VIA CX700M generates a silicon real estate
saving of over 42%. A host of leading digital media, memory and connectivity
technologies are packed into the compact design of the VIA CX700M including:

· Advanced HDTV Display Support – Built in HDTV encoder for connection to the
latest displays, and multi-configuration LVDS/DVI transmitter.

· Graphics – Enhanced video quality is provided through the proven VIA UniChrome™
Pro II IGP core with its 128-bit 2D/3D graphics

· Chromotion Video Engine – Powerful image enhancement technology delivering a
Hi-Def™ visual experience including advanced video acceleration for MPEG-2,
MPEG-4, and WMV9

· Memory Support– VIA’s renowned memory controller technology has been
incorporated into the VIA CX700M, with support for both DDR and the latest low
power high-bandwidth DDR2 memory modules. This includes support for 32-bit DRAM
modules enabling a further reduction in form factor.

· Audio – Integrating the VIA Vinyl HD Audio controller supporting up to eight
high definition channels delivering a richer all-round digital media experience

· Connectivity – Broad connectivity comes with support for SATA II and PATA
drives, six USB2.0 ports, and four PCI slots

Features of VIA CX700M

cx700m blkdiagram VIA Unified CX700M Chipset w/ HDTV support

Features
CX700M
Processor
Support
VIA C7® and
VIA Eden™ processors
Front Side
Bus
533/400MHz
Memory
Support
DDR2
533/400/333 or DDR400/333
Max Memory4 GB
AGP SupportAGP 8X
North/South
Bridge Link
V-Link
(533MB/sec)
Graphics Core
VIA UniChrome™
Pro
Hardware
Video Acceleration
Built in HDTV
Encoder
Dual Monitor
Support
MPEG-2
Video
De-blocking
Yes
Hardware
Display Rotation
Yes
High
Definition Audio
Yes
USB 2.06 ports
PCI
Devices/Slots
4 Slots
Serial ATA2 x SATA 150
devices or
2 x SATA II devices
IDE1 EIDE
channel up to 2 devices

Product Availability and Pricing

The VIA CX700M is expected to be available in volume quantities later in Q3
2006. Pricing is available upon request.