Winbond has announced that they have finally completed R&D for their 12inch wafer fab process, and will be re-entering the DRAM market by the last quarter this year. Winbond will start fabricating 512MBit DDR2 memory based on a 0.11micron process.

Winbond has announced that they have finally completed R&D for their 12inch wafer fab process, and will be re-entering the DRAM market by the last quarter this year. Winbond will start fabricating 512MBit DDR2 memory based on a 0.11micron process.

Winbond general Manager, Mr Zhang reiterated that Winbond’s comeback to the memory market is only transitional, and their strategy of leaving the standard memory market is still in place.