OCZ announced the release of their PowerStream™ family of power supplies. The OCZ PowerStream™ power supplies are the most versatile, most adaptable and quietest power supplies available in the marketplace today. Each OCZ PowerStream™ product includes the state-of-the-art PowerFlex™ feature for fine-tuning the three independently adjustable power rails. An LED indicator sits below all three
Hynix today announced availability of its 1Gb based DDR2 4GB Registered Dual In-line Memory Module (RDIMM) and the industry’s first 2GB SO-DIMM for high performance server and notebook applications. The newly released modules will utilize Hynix’s 1Gb DDR2 device manufactured on the company’s leading edge 0.11-micron process technology. Hynix will plan mass production of both
Visiontek’s Xtasy line of graphics cards have been very successful over the years partially because of their lifetime warranty, good technical support and strong presence in the retail sector. So how will the Xtasy Radeon X800XT Platinum Edition compare to other popular cards available in the retail sector? Let’s take a look…
Intel today announced products that usher in a range of audio, video and other capabilities previously found only on specialty PCs. In addition to making the PC experience more entertaining and productive, these technologies pave the way for such emerging capabilities as High Definition (HD) video, 7.1 surround sound and robust file protection for office
Maxtor announced today its new high-capacity, native SATA MaXLine III hard drives. The third-generation MaXLine drives feature the industry’s first 16MB buffer and are designed to the enterprise standard of 1 million hour mean time to failure (MTTF). With new SATA II features including native command queuing (NCQ), capacity up to 300GB, 7200 RPM speed
This guide will show you how to measure the GPU voltage and increase the voltage through resistor or pencil to improve overclockability.
(P4 3.6E @ 250Mhz FSB, ABIT AA8 Max) Support for Intel EM64T platform: Intel Xeon (Nocona) with 64-bit extension technology. Support for Intel Wireless Multi-Media Extensions (WMMX) platform: Intel PXA27X (Bulverde) with WMMX technology. Support for DDR2-SDRAM platform: Intel 91X, 925X, E771X chipsets, DDR2-SDRAM SPD/EEPROM. Windows Mobile 2003 Second Edition platform: Windows CE .Net
Models Q3 ’04 Q4 ’04 Q1 ’05 Q2 ’05 H2 ’05 Athlon 64 FX SledgeHammer (0.13, SOI, 1MB L2) FX-53 (2.4Ghz) San Diego (90nm, SOI, 1MB L2) FX-55 (2.6Ghz) FX-57 (2.8Ghz) Toledo (90nm, SOI, Dual Core, 2MB L2?) Athlon 64 Newcastle (0.13, SOI, 512KB L2) 3500+ (2.2Ghz) 3800+ (2.4Ghz) Winchester (90nm, SOI, 512KB L2) 4000+
Today we roamed the halls for less prominent but interesting subjects. Check out the video starring the “touch the air” screen similar to what most have seen inside “Minority Report”. Many companies covered, check it out!
Samsung Electronics today announced a wafer level packaging (WLP) technology for 512Mbit DDR2 chips that can enhance electrical properties and reduces physical space of the chips. The new package technology has two patterned inter-layer dielectrics (ILD), with insulating characteristics, and a metal layer replaces the conventional package substrate. The package enhances electrical properties though shorter
Montecito : 90nm, Dual Core, ~2Ghz, 400Mhz FSB, 24MB L3 cache (2 x 12MB Split), 1.7B transistors, Enhanced cache reliability (Pellston), Enhanced workload performance (Foxton), Virtualization (Silvervale), supported by E8870 and Bayshore chipset (PCI Express, DDR2)
H2 2004 H2 2005 2006-07 Itanium MP Madison 9M 1.7Ghz, 9MB L3 – $ 4200 1.6Ghz, 6MB L3 – $ 2250 1.5Ghz, 4MB L3 – $ 1400 Montecito (90nm, Dual Core, ~2Ghz, 24MB L3) Tukwila (65nm, Multi-Core : 4 cores, 32MB L3?) Itanium DP Fanwood 1.6Ghz, 3MB L3 Fanwood LV 1.3Ghz, 3MB L3 –
E04hardware has just posted their first look on the upcoming ABIT Socket 939 motherboard, AV8. According to their observation, ABIT seems to have the CPU multiplier factor locked. Moreover, the DRAM advance setting seems to have some problem too.
Q3 ’04 (Aug) Q4 ’04 Q1 ’05 Q2 ’05 Q3 ’05 Desktop Sempron (256KB L2) 2500+ (462) 2600+ (462) 2800+ (462) 3100+ (754) 3500+ (939) 3200+ (939) 3400+ (754) Mobile Sempron (128/256KB L2) 2600+ (754) 2800+ (754) 3000+ (754) 3100+ (754)
Intel is expected to unveil a technology that could push out the need for chip-to-chip optical interconnects to at least the 15-nm node. Intel will present a paper describing a high-speed signaling technology based on a combination of copper interconnects and CMOS. The chip-to-chip technology is a 130-nm, 8-Gbit/s source-synchronous I/O link. Using “inexpensive” digital
Q2 ’04 Q4 ’04 Q1 ’05 Q2 ’05 H2 ’05 Xeon MP Gallatin-4M (0.13, 4MB L3) Potomac (90nm, 3.5Ghz, 8MB L3) Cranfords (90nm, 3.66Ghz, 1MB L2) Dual Core Chipset TwinCastle Xeon DP Nocona (90nm, 2.8-3.6Ghz, 1MB L2, EM64T) LV Nocona (90nm, 2.8Ghz, EM64T) Irwindale (90nm, 3/3.2/3.4/3.6Ghz, 2MB L2,
SMART announced today its new line of ultra low profile 240-pin registered DDR2 DIMMs in densities of 512MB, 1GB, and 2GB. These new 1.0″ registered memory modules are 15 percent lower in height than industry-standard PC2-3200 and PC2-4300 DIMMs. SMART’s DDR2 modules operate at system clock speeds of 200MHz and 267MHz with data transfer rates
OCZ today announced the release of the DDR Booster, a power-filtering and voltage boost diagnostic device. The OCZ DDR Booster is compatible with all first generation DDR platforms. The DDR Booster uses OCZ’s patent pending Powerclean™ technology to supply cleaner power to the memory module, thereby increasing memory stability and optimizing performance. A digital VDIMM
AMD announced a technology milestone with the completed design of its AMD64 dual-core processors. AMD plans to deliver high-performance dual-core products to the x86 server market in mid-2005 and introduce dual-core solutions for high-end client PCs in the second half of 2005. With an unwavering focus on customer-centric innovation, AMD was the first to present