This guide will show you how to measure the GPU voltage and increase the voltage through resistor or pencil to improve overclockability.
(P4 3.6E @ 250Mhz FSB, ABIT AA8 Max) Support for Intel EM64T platform: Intel Xeon (Nocona) with 64-bit extension technology. Support for Intel Wireless Multi-Media Extensions (WMMX) platform: Intel PXA27X (Bulverde) with WMMX technology. Support for DDR2-SDRAM platform: Intel 91X, 925X, E771X chipsets, DDR2-SDRAM SPD/EEPROM. Windows Mobile 2003 Second Edition platform: Windows CE .Net
Models Q3 ’04 Q4 ’04 Q1 ’05 Q2 ’05 H2 ’05 Athlon 64 FX SledgeHammer (0.13, SOI, 1MB L2) FX-53 (2.4Ghz) San Diego (90nm, SOI, 1MB L2) FX-55 (2.6Ghz) FX-57 (2.8Ghz) Toledo (90nm, SOI, Dual Core, 2MB L2?) Athlon 64 Newcastle (0.13, SOI, 512KB L2) 3500+ (2.2Ghz) 3800+ (2.4Ghz) Winchester (90nm, SOI, 512KB L2) 4000+
Today we roamed the halls for less prominent but interesting subjects. Check out the video starring the “touch the air” screen similar to what most have seen inside “Minority Report”. Many companies covered, check it out!
Samsung Electronics today announced a wafer level packaging (WLP) technology for 512Mbit DDR2 chips that can enhance electrical properties and reduces physical space of the chips. The new package technology has two patterned inter-layer dielectrics (ILD), with insulating characteristics, and a metal layer replaces the conventional package substrate. The package enhances electrical properties though shorter
Montecito : 90nm, Dual Core, ~2Ghz, 400Mhz FSB, 24MB L3 cache (2 x 12MB Split), 1.7B transistors, Enhanced cache reliability (Pellston), Enhanced workload performance (Foxton), Virtualization (Silvervale), supported by E8870 and Bayshore chipset (PCI Express, DDR2)
H2 2004 H2 2005 2006-07 Itanium MP Madison 9M 1.7Ghz, 9MB L3 – $ 4200 1.6Ghz, 6MB L3 – $ 2250 1.5Ghz, 4MB L3 – $ 1400 Montecito (90nm, Dual Core, ~2Ghz, 24MB L3) Tukwila (65nm, Multi-Core : 4 cores, 32MB L3?) Itanium DP Fanwood 1.6Ghz, 3MB L3 Fanwood LV 1.3Ghz, 3MB L3 –
E04hardware has just posted their first look on the upcoming ABIT Socket 939 motherboard, AV8. According to their observation, ABIT seems to have the CPU multiplier factor locked. Moreover, the DRAM advance setting seems to have some problem too.
Q3 ’04 (Aug) Q4 ’04 Q1 ’05 Q2 ’05 Q3 ’05 Desktop Sempron (256KB L2) 2500+ (462) 2600+ (462) 2800+ (462) 3100+ (754) 3500+ (939) 3200+ (939) 3400+ (754) Mobile Sempron (128/256KB L2) 2600+ (754) 2800+ (754) 3000+ (754) 3100+ (754)
Intel is expected to unveil a technology that could push out the need for chip-to-chip optical interconnects to at least the 15-nm node. Intel will present a paper describing a high-speed signaling technology based on a combination of copper interconnects and CMOS. The chip-to-chip technology is a 130-nm, 8-Gbit/s source-synchronous I/O link. Using “inexpensive” digital
Q2 ’04 Q4 ’04 Q1 ’05 Q2 ’05 H2 ’05 Xeon MP Gallatin-4M (0.13, 4MB L3) Potomac (90nm, 3.5Ghz, 8MB L3) Cranfords (90nm, 3.66Ghz, 1MB L2) Dual Core Chipset TwinCastle Xeon DP Nocona (90nm, 2.8-3.6Ghz, 1MB L2, EM64T) LV Nocona (90nm, 2.8Ghz, EM64T) Irwindale (90nm, 3/3.2/3.4/3.6Ghz, 2MB L2,
SMART announced today its new line of ultra low profile 240-pin registered DDR2 DIMMs in densities of 512MB, 1GB, and 2GB. These new 1.0″ registered memory modules are 15 percent lower in height than industry-standard PC2-3200 and PC2-4300 DIMMs. SMART’s DDR2 modules operate at system clock speeds of 200MHz and 267MHz with data transfer rates
OCZ today announced the release of the DDR Booster, a power-filtering and voltage boost diagnostic device. The OCZ DDR Booster is compatible with all first generation DDR platforms. The DDR Booster uses OCZ’s patent pending Powerclean™ technology to supply cleaner power to the memory module, thereby increasing memory stability and optimizing performance. A digital VDIMM
AMD announced a technology milestone with the completed design of its AMD64 dual-core processors. AMD plans to deliver high-performance dual-core products to the x86 server market in mid-2005 and introduce dual-core solutions for high-end client PCs in the second half of 2005. With an unwavering focus on customer-centric innovation, AMD was the first to present
Micron today announced validation of its 1Gb DDR components and 4GB DDR Registered DIMM modules for the AMD Opteron(TM) processor. Validation of these components and modules enables AMD Opteron processor customers to choose DDR registered DIMMs in all densities, including 256MB to 4GB, and at all speed grades, including PC2100, PC2700, and PC3200.
Intel’s newest high-volume wafer fabrication facility has commenced production. Fab 24, a $ 2 billion facility, features 300 mm wafer manufacturing based on Intel’s leading 90nm process technology. Fab 24 is the company’s fourth 300 mm manufacturing facility, making Intel the world leader in 300 mm wafer manufacturing capacity and enabling the company to produce
Babes galore, the hottest topic of Computex will definitely be about the babes warming the halls. VR-Zone is proud to bring you the Computex 2004 Babes Showcase. Some of the photos here are submitted to us by our fellow partners or members. Thanks!
The Centurion line was launched along with the Wave Master, and has so far received mixed reviews from various journalists. It has been criticized for its awkward looks and lack of features, but Cooler Master’s newest Centurion, the Centurion 5 is here to silence the critics.
90nm “Oakville” will arrive in Q3 to replace the current 130nm “Odessa” core with 2800+ (1.8Ghz) and 3000+ (2Ghz) models. In Q1 ’05, “Oakville” will be replaced by “Lancaster” packed with 1MB L2 cache with models ranging from 3200+ (2Ghz) to 3400+ (2.2Ghz) by Q3 ’05 Mobile Sempron will first come in 754-pin package based