Technology

18 September 2007 - Singapore, 17 September 2007 - Canon continues to offer exceptional quality to users with the launch of the 2 new CanoScan models that fit the needs of your digital lifestyle.

31 August 2007 - NTU and Chartered today announced the opening of Chartered@NTU, a 100 square-meter joint laboratory set up by the two organisations, to promote technology exchange and collaboration for joint research and development projects. It will house state-of-the-art equipment such as 12-inch wafer probers and ultra-fast transient measurement systems. They are particularly critical in improving the performance and reliability of the microchips fabricated using 65 nm CMOS technology, which is being widely adopted for microprocessor chips used in high-performance desktop and laptop computers, network workstations as well as game consoles.

20 August 2007 - EETimes reported that IBM and TDK have announced a joint R&D program to bring MRAM memory technology to market. The companies plan to leverage the spin momentum transfer effect in order to shrink memory cells thereby increasing capacity at low cost while maintaining low power, endurance and non-volatility advantages. These properties could make MRAM a preferred technology for automotive, cellphone, handheld computing and industrial controls applications. The project is designed for four years.

19 June 2007 - CommunicAsia 2007, EnterpriseIT2007, InteractiveDME is back in Singapore at Singapore EXPO. Spanning a total of 5 halls (47,000SqM) and featuring 1,653 companies of which 81% are from overseas, we see companies coming from Australia, China, France, Germany, USA etc displaying their solutions and products to meet the changing needs of the various industry and the needs of consumers.

7 June 2007 - More Girls from Computex 2007 on Day 3!

5 June 2007 - Here at Computex 2007, we see all kinds of new hardware not available to the market yet, but that isn't the point! We now present to you a peak of all the showbabes of day 1 in Computex.

26 April 2007 - VIA today announced that the eighth annual VIA Technology Forum will take place in Taipei on Wednesday 6 June, during Computex 2007, with the theme of “Ultra Mobility”. The convergence of computing, communications and entertainment applications and services combined with significant advances in technology integration, power efficiency and miniaturization is accelerating the development and proliferation of a new generation of x86 devices that are smaller, lighter, quieter and with longer battery life than ever before. As the industry leader in ultra mobile platforms, VIA has charged VTF2007 with outlining the principal industry strategies required to drive this trend.

12 April 2007 - IBM will link chips together in a relatively new way that the company says will improve performance and cut power consumption. The technology, called through-silicon vias, or TSV, involves connecting different components or different cores inside of two respective chips through thousands of tiny wires that will carry data back and forth. Now, chips mostly transfer data over channels called buses, which can get overwhelmed, embodied in wires. With TSV, far more data can be transferred per second in a less energy-intensive manner. IBM will deliver samples of communication chips with TSV to customers later this year and begin commercial production in 2008.

8 September 2007 - Intel today broke ground on its first 300mm wafer fabrication facility in Asia. The new factory, named Fab 68, will extend Intel's manufacturing leadership, while helping cultivate engineering talent, accelerate the growth of China's information technology (IT) ecosystem, and bring Intel's culture of environmental leadership to China. The $2.5 billion project is set to begin construction immediately and be operational in 2010. Fab 68 will cover 163,000 square meters of factory space and host a 15,000 square meter clean room.

31 August 2007 - JEDEC has initiated standardization for the Solid State Drive (SSD) segment of the computer industry. The JEDEC effort will focus on broad based standardization of interfaces between the host system and the SSD.

26 July 2007 - The World Cyber Games (WCG) Asian Championship 2007 to be held in Singapore from August 2 – 5 will see a revolutionary change in the power outlet system used to power up all gaming devices. Eubiq is providing more than 100 meters of their world patented power outlet system for the use during WCG Asian Championship. Each 3.6m power track will carry a current load of 20 Amp, and can easily supply more than ten gaming PC with all the necessary power supply.

18 June 2007 - Fujitsu announced development of a platform technology for 45nm generation LSI logic chips, which combines technologies for low power consumption and high-performance interconnect. Compared to previous 45nm technologies on record, the new platform reduces the leakage current that occurs when current is wasted in wait states to one-fifth that of previous levels and reduces interconnect-induced lag times by approximately 14%. The realization of these new 45nm generation platform technologies will enable Fujitsu to offer its customers LSI logic chips that feature even higher speeds, smaller size and lower power consumption than currently available. Fujitsu is targeting 2008 to incorporate these technologies into LSIs that are suited for mobile devices as part of a ubiquitous networking society.

5 June 2007 - We know that everyone is waiting for the hardware, but we just had to show you the babes first. =o

11 May 2007 - Using proprietary technology has enabled micronDR (S) Pte Ltd, the data recovery specialist, to break the ultimate barrier for disk-based data recoveries and achieve a high success rate of 98 percent. The success lies in a patentable technology, called Tecra Clean, that mirrors media coating technology. micronDR has deployed semi-robotics surface recovery technology that “rejuvenates” the disk surface, removing any debris or coating that would have been accumulated during subsequent head disk interfaces during the life of the hard drive before the catastrophic failure. Damaged disks are verified to be “flyable” using a laser-based optical scan or HDI tester. Disks primarily use two basic layers of lube, one of which is fixed while the other is mobile. Over the period of usage, sometimes there is a cumulation of the mobile layer of the lube due to the laws of physics operating on a spinning disk known as centrifugal force, or forces of wander wall, which continuously push the layer to the disk’s outer diameter (OD). This creates a drastic change in the flying profile of the heads between the OD and the inner diameter (ID), sometimes challenging the negative pressure air bearing pads design.

13 April 2007 - IBM has found a way to connect chips inside products ranging from cell phones to supercomputers, an advance that promises to prolong battery life in wireless devices and eventually speed data transfers between the processor and memory chips in computers. In IBM's solution, two chips are sandwiched on top of one another and held together by vertical connections that are etched in silicon holes that are filled with metal. The vertical connections are referred to as "through-silicon-vias," which allow multiple chips to be stacked together with greater information flow between them. IBM could have memory-on-processor technology by 2009 for use in servers, supercomputers and other machines.

10 April 2007 - TSMC would complete 45nm technology qualification and enter production as early as September 2007. The new 45nm process combines the most advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material. TSMC’s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. TSMC’s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.