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Articles tagged with Processors

Intel Mobile Celeron Price Cut


Mobile Celeron

Old Price

New Price

% Drop

2.50GHz 149 134 10
2.40GHz 134 112 16
2.20GHz 112 96 14


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Intel Clackamas Technology (CT) Compatible w/ AMD 64-bit Chips

Intel will probably face questions about its anticipated plans to create chips that function like the Opteron processor from AMD, but it is fairly likely that the company won't face a lawsuit from AMD. Because of the details of a lengthy 1995 legal settlement between Intel and AMD, Intel can in all probability create and sell chips that are completely compatible with AMD's Opteron and Athlon 64 chips, which can run both 32- and 64-bit software. Intel won't even have to pay AMD royalties if it incorporates ideas from any AMD patents into its chips. Intel may have to rename some of the instructions, or commands, embedded in any chip that is similar to Opteron, but "the code can be 100 percent compatible. Software developers will not have to write two different versions of their applications to satisfy the market.

Microsoft will also have to write one version of Windows XP and Windows Server 2003 for computers with 32/64-bit chips. Microsoft only plans to come out with one core version of Windows XP and Windows Server 2003 for the respective markets each OS addresses. Windows XP for 32/64-bit systems is slated for the second half of the year. For AMD, the existence of a 32/64-bit Intel chip would deprive the company of a competitive advantage but they wouldn't have to worry about courting developers to write software for the 15 percent of the market that AMD commands. Intel is expected to demonstrate a Pentium class chip next week at IDF that can run 32-bit software, which is used on Windows desktops today, and 64-bit software, which is used on high-end servers to run databases and other complex applications. The code name for the enabling technology is Clackamas.


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IBM 90nm, SOI, Strained Silicon Chip

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IBM today announced it has developed a new method of manufacturing low power, high performance microprocessors using an industry-first combination of silicon-on-insulator (SOI), strained silicon and copper wiring technologies. IBM is putting the technique immediately to work in volume 90 nanometer production at its 300mm manufacturing facility. Powered by 58 million transistors, 64-bit PowerPC 970FX microprocessor will be the first chip built using this trio of IBM technology breakthroughs. Early PowerPC 970FX chips produced with the new technology deliver significant power savings, while performing at an equal or higher clock speed than comparable processors. The company expects to realize even greater gains in processor efficiency as it ramps production of the new process technology.


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Intel Prescott D-0 Stepping

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Intel® Pentium® 4 processor with 1MB L2 Cache on the 90nm Process Technology, will undergo the following changes for the C-0 to the D-0 core processor stepping change :

- CPUID will change from 0F33h to oF34h
- D-0 will incorporate planned power optimizations to enable speed enhancements
- D-0 is pin compatible with C-0


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Opteron & Athlon 64 On DDR-II In Late 2004


Models

Q2 2004 Q4 2004 2005
Opteron SledgeHammer
(0.13, SOI, 1MB L2, DC DDR400)
850 (2.4Ghz)
250 (2.4Ghz)
150 (2.4Ghz)
Athens/Troy/Venus
(90nm
, SOI, 1MB L2, DC DDR-II 667?)
852 (2.6Ghz)
252 (2.6Ghz)
152 (2.6Ghz)
Egypt/Italy/
Denmark
: 90nm
Athlon 64 FX SledgeHammer 939
(0.13, SOI, 1MB L2, DC DDR400)
FX-53 (2.4Ghz)
San Diego
(90nm, SOI, 1MB L2, DC DDR-II 667?)
FX-55 (2.6Ghz)
Toledo : 90nm
Athlon 64 Newcastle 939
(0.13, SOI, 512KB L2, DC DDR400)
3700+ (2.4Ghz)
3400+ (2.2Ghz)
Winchester
(90nm, SOI, 512KB L2, DC DDR-II 667?)
4000+ (2.6Ghz)
3700+ (2.4Ghz)
 

AMD is quietly adding DDR-II support into its upcoming Opteron and possibly Athlon 64 microprocessors that are set to come in a pretty near future. Some mainboard makers indicate that there are Opteron processors with dual-channel DDR-II SDRAM memory controllers coming in late Q4 2004 or early Q1 2005. What may seem to be highly possible is that AMD may add support for 533MHz, 667MHz and 800MHz speed flavours of DDR-II, but not to cope with 400MHz bin. “667MHz may be considered as a good option, keeping in mind its speed, latencies and costs” a source close to the Sunnyvale, California-based chipmaker noted.


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Sun Processor Plans

Sun showed a version of the UltraSparc IV+, code-named Panther that will include new high-speed cache memory the current UltraSparc IV lacks. Sun expects the UltraSparc IV+ to double performance over UltraSparc IV. Sun first incorporated of on-chip cache in its UltraSparc IIIi "Jalapeno" processor for mid-range computers that debuted in 2003. The UltraSparc IIIi+ will have quadruple the on-chip cache, or 4MB. UltraSparc IIIi+ and IV+ will be built with 90-nanometer features. Sun's UltraSparc IV combines two UltraSparc III processors on a single slice of silicon, a so-called dual-core design technique IBM and HP already adopted and that Intel and AMD will.

Sun also discussed its longer-range chip plans that are better able to juggle multiple instruction sequences, called threads. Sun's dual-core UltraSparc IV can handle two simultaneous threads. Another chip, code-named Niagara, will be able to handle 32 simultaneous threads using eight cores that can each handle four threads, but it won't be able to execute a single thread at maximum speed. For maximum single-thread performance, Sun will rely on the "Rock" family of processors, which also will be able to execute multiple threads. In addition the new generation of chip multithreading will provide extra optimization for Java code processing.


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Sony & Toshiba To Develop 45nm Chip

Sony and Toshiba plan to each invest 10 billion yen ($ 95 million) to jointly develop a microchip that will be smaller and more powerful than any now available. The planned next-generation semiconductor will have 45-nanometre circuitry -- even narrower than the circuitry planned for "cell", a 65-nanometre microprocessor being developed by the two companies and IBM. Toshiba and Sony target completion of a 45-nanometre system LSI (large-scale integrated) -- a high-end microchip that combines multiple functions on one piece of silicon to power everything from DVD recorders to game machines -- by late 2005.


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Sun Multicores CPU - Rock

Sun Microsystems will discuss a future high-end processor a chip code-named Rock at Sun's analyst conference in San Francisco that will combine features of own designs with technology it acquired from Afara Websystems. Sun has talked about the existence of the chip before, but not disclosed its name or provided many details beyond the projection that it will provide 30 times the performance of a 1.2GHz UltraSparc III. The Rock chips combine technology from Sun's own MAJC chip with technology from Afara Websystems, which specialized in chips with multiple processor cores on the same slice of silicon.


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VIA Eden ESP 1Ghz Fanless CPU

VIA today announced the worldwide availability of the new VIA Eden™ ESP10000 and ESP8000 processors. Based on the advanced CoolStream™ architecture of the "Nehemiah" core, the VIA Eden™ ESP10000 and ESP8000 combine enhanced digital media performance with unique thermal characteristics that minimize power consumption to as little as 7 watts when running at a speed of 1GHz, enabling the development of more compact systems that run quieter and cooler. They also boast the second generation PadLock Security Suite, the industry's most advanced embedded hardware technologies that includes high-speed hardware based AES encryption and two Random Number Generators (RNGs). The VIA Eden ESP8000 and VIA Eden ESP10000 are shipping in volume now, at prices of US$ 85 and US$ 100 respectively.


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Intel Mobile CPUs Roadmap Update


  Q2 '04 Q3 '04 Q4 '04 Q1 '05
Mobile Pentium 4 E
(90nm, 1MB L2, 533Mhz PSB)
Prescott-M 2.8A, 3.06A, 3.2Ghz
($ 202, $ 234, $ 294)
Prescott-M 3.46Ghz Prescott-M 3.6Ghz Prescott-M 3.73Ghz
Mobile Celeron
(90nm, 256KB L2, 533Mhz PSB)
Celeron-M 2.53, 2.66, 2.8, 3.06Ghz
($ 75, $ 85, $ 109)
Celeron-M 3.2Ghz Celeron-M 3.33Ghz Celeron-M 3.46Ghz


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Some Intel IDF Highlights

Intel will unveil a multi-company initiative to support a 480 Mbit/s wireless USB technology over 10 meters based on UWB. Backers will include Dolby Labs and many of the companies currently supporting the wired USB 2.0 specification, said an Intel spokesman. The wireless USB initiative and the Intel chip will be based on the multiband OFDM technology backed by an industry alliance that includes Intel. It will also be supported by the WiMedia Alliance that is helping define UWB software interoperability. The wireless USB chips are not expected to ship in products until 2005.

The Intel spokesman would not confirm or deny reports that the company will demonstrate a 64-bit x86 at IDF. However, he did say "the subject will be brokered," probably in the keynote address of Craig Barrett, Intel's chief executive. Intel will also announce its first 90-nm communications processors at IDF with plans to apply the in-house technology across its portfolio of wired and wireless parts. In total, Intel will make as many as 16 new announcements at IDF. Third parties are planning about a dozen more. Other news at IDF will include new tools to ensure interoperability of digital home products, new NOR flash technology and the creation of a memory implementers' forum to address issues with DDR II and a front-side bus in-line memory module.


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Dothan Scheduled For May

Taiwan’s notebook makers have been upset as the launch of Intel’s mobile Dothan processors has been delayed to April or May from a revised schedule most recently slated for early February. Local makers said they are now uncertain when Intel will start actually delivering the Dothan processors, but they have rescheduled their production lines for deliveries in May. The sources speculated that Intel is focusing its relatively limited 90nm capacity on the desktop-use Prescott processors in order to better compete with AMD’s newly launched Athlon 64 3400+ processors for high-end desktop PCs. The delay of Dothan is not expected to affect the demand for Centrino notebooks.


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Next Gen. XBox Come In Fall 2005

The next version of Microsoft Xbox video game console could be released in the fall of 2005, without the hard drive that was one of the defining characteristics of the current game console. The console would use three IBM processors based on the new generation of powerful 64-bit computing technology and a graphics chip from ATI. The new console would likely be shipped without a hard drive and said it was not "guaranteed" that the new console would be able to play current Xbox games. By eliminating the hard drive, Microsoft could reduce the cost of production while allowing game data to be stored on flash memory. Both Microsoft and Sony are expected to divulge more details on the next generation of their hardware in the coming months at industry conferences in March and May. Most in the industry had expected those next-generation systems to come out only in 2005 or 2006.


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Notebook Makers To Use Desktop Prescott

Some second-tier Taiwanese notebook makers will roll out models using Intel desktop-use Prescott processors before the chip giant launches notebook-use Mobile Prescott processors in the second quarter of this year. Aimed at the desktop replacement market, the desktop Prescott notebooks will weigh around 3-3.5 kilograms, have a thickness of about 40mm and consume around 103 watts of power. Using desktop Prescott processors will give them cost advantages over using Mobile Prescott processors. Desktop Prescott processors at 2.8, 3.0 and 3.2GHz with 800Mhz FSB will be priced at US$ 178, US$ 218 and US$ 278, respectively compared to Mobile Prescott processors 3.06, 3.2 and 3.46GHz with a 533MHz FSB at US$ 234, US$ 294 and US$ 433, respectively.


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Intel CPU Price Cut

Processor Models FSB/Cache Old Price (US$ ) New Price (US$ ) % Change
Desktop
P4 EE 3.40 800/2MB L3 - 999 -
P4 EE 3.20 800/2MB L3 - 925 -
P4 3.40E 800/1MB L2 - 417 -
P4 3.40 800/512KB L2 - 417 -
P4 3.2E 800/1MB L2 - 278 -
P4 3.2 800/512KB L2 417 278 - 33%
P4 3.0E 800/1MB L2 - 218 -
P4 3.0 800/512KB L2 278 218 - 22%
P4 3.06 533/512KB L2 262 218 - 17%
P4 2.80E 800/1MB L2 - 178 -
P4 2.80C 800/512KB L2 218 178 - 18%
P4 2.80A 533/1MB L2 - 163 -
P4 2.80 533/512KB L2 193 163 - 16%
Mobile
P4 3.2 HT 512KB L2 433 294 - 32%
P4 3.06 HT 512KB L2 294 234 - 20%
P4 3.06 512KB L2 278 218 - 22%
P4 2.80 HT 512KB L2 234 202 - 14%
P4 2.80 512KB L2 218 186 - 15%


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